JPH0212729B2 - - Google Patents

Info

Publication number
JPH0212729B2
JPH0212729B2 JP59229356A JP22935684A JPH0212729B2 JP H0212729 B2 JPH0212729 B2 JP H0212729B2 JP 59229356 A JP59229356 A JP 59229356A JP 22935684 A JP22935684 A JP 22935684A JP H0212729 B2 JPH0212729 B2 JP H0212729B2
Authority
JP
Japan
Prior art keywords
grindstone
cut
columnar material
cutting blade
cutting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59229356A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61106207A (ja
Inventor
Susumu Terasawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Seimitsu Co Ltd
Original Assignee
Tokyo Seimitsu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Seimitsu Co Ltd filed Critical Tokyo Seimitsu Co Ltd
Priority to JP22935684A priority Critical patent/JPS61106207A/ja
Publication of JPS61106207A publication Critical patent/JPS61106207A/ja
Publication of JPH0212729B2 publication Critical patent/JPH0212729B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/003—Multipurpose machines; Equipment therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Mining & Mineral Resources (AREA)
  • Mechanical Engineering (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
JP22935684A 1984-10-31 1984-10-31 ウエハー製造方法並びに装置 Granted JPS61106207A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22935684A JPS61106207A (ja) 1984-10-31 1984-10-31 ウエハー製造方法並びに装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22935684A JPS61106207A (ja) 1984-10-31 1984-10-31 ウエハー製造方法並びに装置

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP3018085A Division JPH0613173B2 (ja) 1991-02-08 1991-02-08 ウエハー製造装置
JP3018086A Division JP2537573B2 (ja) 1991-02-08 1991-02-08 半導体ウエハ―製造方法

Publications (2)

Publication Number Publication Date
JPS61106207A JPS61106207A (ja) 1986-05-24
JPH0212729B2 true JPH0212729B2 (en]) 1990-03-26

Family

ID=16890879

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22935684A Granted JPS61106207A (ja) 1984-10-31 1984-10-31 ウエハー製造方法並びに装置

Country Status (1)

Country Link
JP (1) JPS61106207A (en])

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0750972A1 (en) * 1995-06-30 1997-01-02 Tokyo Seimitsu Co.,Ltd. Ingot slicing machine with built-in grinder

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6296400A (ja) * 1985-10-23 1987-05-02 Mitsubishi Metal Corp ウエハの製造方法
JPH0661681B2 (ja) * 1987-07-06 1994-08-17 三菱マテリアル株式会社 鏡面ウェ−ハの製造方法
DE3884903T2 (de) * 1987-10-29 1994-02-10 Tokyo Seimitsu Co Ltd Vorrichtung und Verfahren zum Abschneiden einer Halbleiterscheibe.
JP2737783B2 (ja) * 1988-02-18 1998-04-08 株式会社 東京精密 ウエハの切断装置
US5218948A (en) * 1988-03-11 1993-06-15 Mitsubishi Kinzoku Kabushiki Kaisha Inside diameter blade
JPH01138565U (en]) * 1988-03-11 1989-09-21
US5111622A (en) * 1989-05-18 1992-05-12 Silicon Technology Corporation Slicing and grinding system for a wafer slicing machine
DE4136566C1 (en]) * 1991-11-07 1993-04-22 Gmn Georg Mueller Nuernberg Ag, 8500 Nuernberg, De

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2382257A (en) * 1943-04-21 1945-08-14 Albert Ramsay Manufacture of piezoelectric oscillator blanks

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0750972A1 (en) * 1995-06-30 1997-01-02 Tokyo Seimitsu Co.,Ltd. Ingot slicing machine with built-in grinder

Also Published As

Publication number Publication date
JPS61106207A (ja) 1986-05-24

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